Patent Assignment
Reel/Frame 063449/0459
Assignment of Assignor's Interest
Recorded: 2023-04-26
Pages: 5
Assignor
KANG, MYUNG SAM
Executed: 2023-02-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Organic Interposer
Application:
18/139,535 →
Publication:
US 2024/0079302