Patent Assignment
Reel/Frame 063455/0255
Assignment of Assignor's Interest
Recorded: 2023-04-27
Pages: 2
Assignor
LEE, BYUNG HO
Executed: 2023-04-24
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Bonding Pad