Patent Assignment
Reel/Frame 063460/0266
Assignment of Assignor's Interest
Recorded: 2023-04-27
Pages: 5
Assignors
ANDERSON, MERVE
Executed: 2023-03-26
ERITT, MICHAEL
Executed: 2023-04-01
GEOERG, JUDITH
Executed: 2023-03-02
MEISSNER, MICHAEL
Executed: 2023-04-11
Assignee
HELIATEK GMBH
TREIDLERSTRASSE 3, DRESDEN, 01139, GERMANY
Covered Property
(1)
Encapsulation System for an Optoelectronic Component Comprising at Least a First Encapsulation and a Second Encapsulation, and Optoelectronic Component Comprising an Encapsulation System of This Kind
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.