IP Library Assignment 063698/0736
Patent Assignment
Reel/Frame 063698/0736

Assignment of Assignor's Interest

Recorded: 2023-05-19 Pages: 4
Assignor
WICHTENDAHL, RALPH
Executed: 2023-05-04
Assignee
HELIATEK GMBH
TREIDLERSTRASSE 3, DRESDEN, 01139, GERMANY
Covered Property (1)
Encapsulation System for an Optoelectronic Component Comprising at Least a First Encapsulation and a Second Encapsulation, and Optoelectronic Component Comprising an Encapsulation System of This Kind
Application: 17/790,763 →
Publication: US 2023/0036237
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 27, 2023
From: ANDERSON, MERVE; ERITT, MICHAEL; GEOERG, JUDITH; MEISSNER, MICHAEL
To: HELIATEK GMBH
Reel/Frame 063460/0266 →