Patent Assignment
Reel/Frame 063465/0517
Assignment of Assignor's Interest
Recorded: 2023-04-27
Pages: 3
Assignors
CHUNG, MING-TSU
Executed: 2023-04-26
LIN, YUNG-CHI
Executed: 2023-04-26
CHEN, YEN-MING
Executed: 2023-04-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stealth Patterning Formation for Bonding Improvement
Application:
18/308,266 →
Publication:
US 2024/0363359