IP Library Assignment 063474/0876
Patent Assignment
Reel/Frame 063474/0876

Assignment of Assignor's Interest

Recorded: 2023-04-28 Pages: 10
Assignors
CHECK, MICHAEL
Executed: 2023-04-24
BERGMANN, MICHAEL JOHN
Executed: 2023-04-24
SUICH, DAVID
Executed: 2023-04-24
HABERERN, KEVIN
Executed: 2023-04-26
Assignee
CREELED, INC.
4001 E HWY 54, SUITE 2000, DURHAM, NORTH CAROLINA, 27709
Covered Properties (2)
Light-Emitting Diode Chip Structures with Electrically Insulating Substrates and Related Methods
Application: 18/308,323 →
Publication: US 2023/0361249
Light-Emitting Diode Chip Structures with Electrically Insulating Substrates and Related Methods
Application: 63/364,234 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →