Patent Assignment
Reel/Frame 063480/0160
Assignment of Assignor's Interest
Recorded: 2023-04-28
Pages: 4
Assignor
OH, JOOYOUNG
Executed: 2023-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Chip on First Insulating Layer with Higher Coefficient of Thermal Expansion and Lower Tensile Strength and Near by Second Insulating Layer with Lower Coefficient of Thermal Expansion and Higher Tensile Strength
Application:
18/309,179 →
Publication:
US 2024/0063144