IP Library › Assignment 063483/0047
Patent Assignment
Reel/Frame 063483/0047

Assignment of Assignor's Interest

Recorded: 2023-04-28 Pages: 6
Assignors
SEONG, HASEOB
Executed: 2023-02-21
JANG, AENEE
Executed: 2023-02-17
Assignee
SEONG, HASEOB, SEON
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Method of Manufacturing Same
Application: 18/140,960 →
Publication: US 2024/0055379
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 63483 Frame: 47. Assignor(S) Hereby Confirms the Assignment . Mar 14, 2024
From: SEONG, HASEOB; JANG, AENEE
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 066798/0893 →