Patent Assignment
Reel/Frame 063483/0098
Assignment of Assignor's Interest
Recorded: 2023-04-28
Pages: 4
Assignors
WANG, CHAO-HSUN
Executed: 2020-12-28
HSUEH, WANG-JUNG
Executed: 2020-12-28
YANG, FU-KAI
Executed: 2020-12-28
WANG, MEI-YUN
Executed: 2020-12-28
WANG, SHENG-HSIUNG
Executed: 2020-12-28
HUANG, SHIH-HSIEN
Executed: 2020-12-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures and Methods of Fabrication Thereof