IP Library › Assignment 063485/0188
Patent Assignment
Reel/Frame 063485/0188

Assignment of Assignor's Interest

Recorded: 2023-04-27 Pages: 4
Assignors
KIM, SEONGHOON
Executed: 2023-04-19
LEE, YOUNGJU
Executed: 2023-04-19
JEON, HEUISOO
Executed: 2023-04-19
KIM, KYUNGTAE
Executed: 2023-04-19
KIM, KWANGTAI
Executed: 2023-04-19
YEOM, DONGHYUN
Executed: 2023-04-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electronic Devices Including Polymer Layer Having Pattern Formed Thereon
Application: 18/308,310 →
Publication: US 2023/0266799