Patent Assignment
Reel/Frame 063505/0121
Assignment of Assignor's Interest
Recorded: 2023-05-02
Pages: 3
Assignors
LI, HUAN-SHIANG
Executed: 2023-03-23
JIANG, YIH-JENN
Executed: 2023-03-23
CHANG, CHENG-KAI
Executed: 2023-03-23
TSAI, WEI-SON
Executed: 2023-03-23
WANG, YI-CHIEH
Executed: 2023-03-23
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Fabricating Method Thereof
Application:
18/310,644 →
Publication:
US 2024/0266335