Patent Assignment
Reel/Frame 063517/0194
Assignment of Assignor's Interest
Recorded: 2023-05-03
Pages: 4
Assignors
MEKONNEN, YIDNEKACHEW S.
Executed: 2017-03-20
AYGUN, KEMAL
Executed: 2017-03-20
MAHAJAN, RAVINDRANATH V.
Executed: 2017-03-20
BALDWIN, CHRISTOPHER S.
Executed: 2017-03-20
SWAMINATHAN, RAJASEKARAN
Executed: 2017-03-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multiple Die Package Using an Embedded Bridge Connecting Dies