Patent Assignment
Reel/Frame 063517/0212
Assignment of Assignor's Interest
Recorded: 2023-05-03
Pages: 4
Assignors
LI, SHENG-CHAN
Executed: 2020-09-01
CHOU, CHENG-HSIEN
Executed: 2020-09-01
CHEN, SHENG-CHAU
Executed: 2020-09-01
TSAI, CHENG-YUAN
Executed: 2020-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Notched Wafer and Bonding Support Structure to Improve Wafer Stacking
Application:
18/311,304 →
Publication:
US 2023/0275064