Patent Assignment
Reel/Frame 063521/0742
Assignment of Assignor's Interest
Recorded: 2023-05-03
Pages: 4
Assignor
CHANG, JEN-YUAN
Executed: 2022-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Structure Including Bonding a Plurality of First Semiconductor Dies to a Plurality of Second Semiconductor Dies
Application:
18/169,337 →
Publication:
US 2024/0063185