Patent Assignment
Reel/Frame 063532/0597
Assignment of Assignor's Interest
Recorded: 2023-05-04
Pages: 4
Assignor
UENO, JUNICHI
Executed: 2023-03-30
Assignee
SHIN-ETSU HANDOTAI CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1000004, JAPAN
Covered Property
(1)
Polishing Pad, Double-Side Polishing Device, and Double-Side Polishing Method for Wafer
Application:
18/035,339 →
Publication:
US 2024/0009799