Patent Assignment
Reel/Frame 063536/0859
Assignment of Assignor's Interest
Recorded: 2023-05-04
Pages: 9
Assignors
CHO, CHULMIN
Executed: 2023-04-13
KO, SEUNGHWAN
Executed: 2023-04-17
SHIN, WOOSEOP
Executed: 2023-04-17
KIM, MINWOO
Executed: 2023-04-13
OH, KYOUNGWHAN
Executed: 2023-04-13
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
1, GWANAK-RO, GWANAK-GU, SEOUL, 08826, KOREA, REPUBLIC OF
Covered Property
(1)
Heating Plate and Substrate Processing Apparatus Including the Same
Application:
18/306,570 →
Publication:
US 2024/0155741