Patent Assignment
Reel/Frame 063540/0015
Assignment of Assignor's Interest
Recorded: 2023-05-04
Pages: 6
Assignors
LEE, YEOJIN
Executed: 2023-01-30
KANG, HYUNJAE
Executed: 2023-01-31
KIM, SANGJIN
Executed: 2023-01-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device