Patent Assignment
Reel/Frame 063544/0810
Assignment of Assignor's Interest
Recorded: 2023-05-04
Pages: 3
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Element and Manufacturing Method Thereof