Patent Assignment
Reel/Frame 063569/0673
Assignment of Assignor's Interest
Recorded: 2023-05-08
Pages: 3
Assignors
CHEN, FANG-I
Executed: 2023-03-29
TSAI, PEI-KENG
Executed: 2023-04-11
HUANG, HUI-CHI
Executed: 2023-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Edge Trimming Process Including Water Jet and Wedge Separation and Methods Thereof