Patent Assignment
Reel/Frame 063577/0233
Assignment of Assignor's Interest
Recorded: 2023-05-09
Pages: 6
Assignors
CHUNG, SANGGYO
Executed: 2023-03-02
LEE, CHANMI
Executed: 2023-03-02
HAN, SEUNGHEE
Executed: 2023-03-02
HONG, JUNGPYO
Executed: 2023-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device