Patent Assignment
Reel/Frame 063577/0661
Assignment of Assignor's Interest
Recorded: 2023-05-09
Pages: 4
Assignors
LEE, JUN KYU
Executed: 2023-04-07
KIM, HONGJIN
Executed: 2023-04-07
BANG, JEONGJAE
Executed: 2023-04-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Transfer Device, Substrate Transfer System and Substrate Transfer Method