Patent Assignment
Reel/Frame 063584/0034
Assignment of Assignor's Interest
Recorded: 2023-05-09
Pages: 4
Assignors
ZHUANG, HUI-ZHONG
Executed: 2023-05-07
LI, JOHNNY CHIAHAO
Executed: 2023-05-07
LIN, TZU-YING
Executed: 2023-05-08
GAO, JIA-HONG
Executed: 2023-05-08
YANG, JUNG-CHAN
Executed: 2023-05-07
KAO, JERRY CHANG JUI
Executed: 2023-05-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same
Application:
18/314,536 →
Publication:
US 2024/0038762