Patent Assignment
Reel/Frame 063584/0578
Assignment of Assignor's Interest
Recorded: 2023-05-09
Pages: 8
Assignors
MOK, IN SU
Executed: 2020-09-01
LEE, SANG HYOUN
Executed: 2020-09-01
DO, WON CHUL
Executed: 2020-09-01
KHIM, JIN YOUNG
Executed: 2020-09-01
Assignee
AMKOR TECHNOLOGY KOREA, INC.
100, AMKOR-RO, BUK-GU, GWANGJU, 61006, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Fabricating Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 15, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054655/0714 →
Assignment of Assignor's Interest
May 9, 2023
From: HINER, DAVID; KELLY, MICHAEL; HUEMOELLER, RONALD
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063583/0928 →