Patent Assignment
Reel/Frame 063584/0614
Assignment of Assignor's Interest
Recorded: 2023-05-09
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Shielding Material Containing Conductive Spheres
Application:
18/314,571 →
Publication:
US 2024/0379580