Patent Assignment
Reel/Frame 063592/0810
Assignment of Assignor's Interest
Recorded: 2023-05-10
Pages: 7
Assignors
JEON, TAEJUN
Executed: 2023-02-28
PARK, JUNWOO
Executed: 2023-02-28
LEE, YONGKWAN
Executed: 2023-02-28
KIM, SEUNG HWAN
Executed: 2023-02-28
KIM, JONGWAN
Executed: 2023-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Horizontally Spaced Chip and Interposer Substrate
Application:
18/195,429 →
Publication:
US 2024/0079342