Patent Assignment
Reel/Frame 063598/0823
Assignment of Assignor's Interest
Recorded: 2023-05-10
Pages: 4
Assignors
CHIANG, YUEH
Executed: 2023-05-07
CHIU, SHANG-HSUAN
Executed: 2023-05-01
LU, MING-XIANG
Executed: 2023-05-02
CHANG, KUANG-CHING
Executed: 2023-05-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming the Same