IP Library › Assignment 063609/0823
Patent Assignment
Reel/Frame 063609/0823

Assignment of Assignor's Interest

Recorded: 2023-05-11 Pages: 3
Assignors
CHEN, XIANMING
Executed: 2023-04-14
HUANG, JUCHEN
Executed: 2023-04-13
XU, XIAOWEI
Executed: 2023-04-13
HUANG, BENXIA
Executed: 2023-04-13
HUANG, GAO
Executed: 2023-04-13
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI,, GUANGDONG,, 519175, CHINA
Covered Property (1)
Liquid Circulating Cooling Package Substrate and Manufacturing Method Thereof
Application: 18/196,012 →
Publication: US 2023/0369167