Patent Assignment
Reel/Frame 063640/0491
Assignment of Assignor's Interest
Recorded: 2023-05-15
Pages: 14
Assignors
HAYASHI, CHIHIRO
Executed: 2023-03-27
KAKITANI, MINORU
Executed: 2023-03-27
SATO, NAOYOSHI
Executed: 2023-03-27
TANIGAWA, TAKAO
Executed: 2023-03-29
HORIE, AKIRA
Executed: 2023-03-27
AKEBI, RYUJI
Executed: 2023-04-03
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property
(1)
Maleimide Resin Composition, Prepreg, Resin Film, Laminated Board, Printed Wiring Board, and Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.