Patent Assignment
Reel/Frame 063644/0566
Assignment of Assignor's Interest
Recorded: 2023-05-15
Pages: 7
Assignors
LEE, JONGJIN
Executed: 2023-05-12
BAEK, JAEJIK
Executed: 2023-05-12
JUNG, MYUNGHOON
Executed: 2023-05-12
SEO, KANG-ILL
Executed: 2023-05-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Transistor Device Including Backside Contact Structure Vertically Between Backside Power Rail and Source/Drain Structure and Method of Forming Thereof