Patent Assignment
Reel/Frame 063646/0355
Assignment of Assignor's Interest
Recorded: 2023-05-15
Pages: 2
Assignors
WANG, PO-SHENG
Executed: 2020-08-05
CHENG, CHAO YUAN
Executed: 2020-08-05
TIEN, CHIEN-CHI
Executed: 2020-08-05
LIN, YANGSYU
Executed: 2020-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Forming Same