Patent Assignment
Reel/Frame 063657/0523
Assignment of Assignor's Interest
Recorded: 2023-05-16
Pages: 5
Assignors
WU, CHIH-WEI
Executed: 2023-04-25
SU, AN-JHIH
Executed: 2023-04-27
TSENG, HUA-WEI
Executed: 2023-04-26
SHIH, YING-CHING
Executed: 2023-04-25
CHIOU, WEN-CHIH
Executed: 2023-04-25
CHEN, CHUN-WEI
Executed: 2023-04-25
YEH, MING SHIH
Executed: 2023-04-25
WU, WEI-CHENG
Executed: 2023-05-05
YEH, DER-CHYANG
Executed: 2023-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Semiconductor Die Package and Methods of Manufacturing
Application:
18/308,032 →
Publication:
US 2024/0128211
Semiconductor Die Package and Methods of Manufacturing
Application:
63/379,489 →