Patent Assignment
Reel/Frame 063658/0086
Assignment of Assignor's Interest
Recorded: 2023-05-16
Pages: 7
Assignors
JANG, YEONHO
Executed: 2023-03-13
SONG, INHYUNG
Executed: 2023-03-13
MUN, KYUNGDON
Executed: 2023-03-13
HWANG, HYEONJEONG
Executed: 2023-03-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Heat Dissipation Structure