Patent Assignment
Reel/Frame 063665/0290
Assignment of Assignor's Interest
Recorded: 2023-05-16
Pages: 6
Assignors
OH, YOUNGTEK
Executed: 2023-04-21
HWANG, KYUNGWOOK
Executed: 2023-04-21
KIM, DONGKYUN
Executed: 2023-04-21
KIM, DONGHO
Executed: 2023-04-21
PARK, JOONYONG
Executed: 2023-04-21
SONG, SANGHOON
Executed: 2023-04-21
YU, MINCHUL
Executed: 2023-04-21
HWANG, JUNSIK
Executed: 2023-04-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Wet-Transferring Device
Application:
18/198,089 →
Publication:
US 2024/0178342