Assignment of Assignor's Interest

Recorded: 2023-05-17 Pages: 4

Assignors

TOBA, MASAYA

Executed: 2023-04-20

MITSUKURA, KAZUYUKI

Executed: 2023-04-17

YAMAGUCHI, MASAKI

Executed: 2023-04-11

Assignee

RESONAC CORPORATION

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN

Covered Property (1)

Method for Manufacturing Wiring Board, Method for Manufacturing Semiconductor Device, and Resin Sheet

Application: 18/247,077 →

Publication: US 2024/0030044

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.