Patent Assignment
Reel/Frame 063669/0565
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 8
Assignors
HUANG, SIN-YAO
Executed: 2019-08-20
LIN, JENG-SHYAN
Executed: 2019-08-20
CHOU, SHIH-PEI
Executed: 2019-08-26
HSU, TZU-HSUAN
Executed: 2019-08-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Isolation Structure for Bond Pad Structure