Patent Assignment
Reel/Frame 063670/0124
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 3
Assignors
HSUEH, HSIU-WEN
Executed: 2020-11-03
CHEN, CHII-PING
Executed: 2020-11-03
HUANG, PO-HSIANG
Executed: 2020-11-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier Free Interface Between Beol Interconnects