Assignment of Assignor's Interest

Recorded: 2023-05-17 Pages: 6

Assignors

SHIN, NARAE

Executed: 2023-04-05

KIM, YOUNGBAE

Executed: 2023-04-05

YOON, YOUNGJUN

Executed: 2023-04-05

HA, JEONGKYU

Executed: 2023-04-05

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package and Method of Manufacturing the Semiconductor Package

Application: 18/318,827 →

Publication: US 2024/0088003