Patent Assignment
Reel/Frame 063674/0764
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 2
Assignor
LIN, LIANG-CHEN
Executed: 2020-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Cumulative Sealing Structures