Patent Assignment
Reel/Frame 063675/0484
Assignment of Assignor's Interest
Recorded: 2023-05-17
Pages: 4
Assignor
KIM, HONGJIN
Executed: 2023-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/319,193 →
Publication:
US 2024/0079400