Assignment of Assignor's Interest

Recorded: 2023-05-19 Pages: 4

Assignor

TANAKA, KIYOTAKA

Executed: 2023-04-28

Assignee

SHINKAWA LTD.

51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN

Covered Property (1)

Bump-Forming Device, Bump-Forming Method, and Non-Transitory Computer-Readable Medium

Application: 18/037,760 →

Publication: US 2024/0055388

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.