Merger

Recorded: 2026-01-29 Pages: 17

Assignor

SHINKAWA LTD.

Executed: 2025-07-01

Assignee

YAMAHA ROBOTICS CO., LTD.

51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN

Covered Property (1)

Bump-Forming Device, Bump-Forming Method, and Non-Transitory Computer-Readable Medium

Application: 18/037,760 →

Publication: US 2024/0055388

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.