Patent Assignment
Reel/Frame 063699/0266
Assignment of Assignor's Interest
Recorded: 2023-05-19
Pages: 4
Assignors
CHUANG, HARRY-HAKLAY
Executed: 2023-04-26
WU, WEI-CHENG
Executed: 2023-04-26
TSAI, CHIH-PENG
Executed: 2023-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Cap Layer for Pad Oxidation Prevention
Application:
18/307,165 →
Publication:
US 2024/0243080