Patent Assignment
Reel/Frame 063731/0544
Assignment of Assignor's Interest
Recorded: 2023-05-23
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three Dimensional Semiconductor Device and Method of Manufacturing the Same
Application:
18/321,243 →
Publication:
US 2024/0107774