Patent Assignment
Reel/Frame 063736/0503
Assignment of Assignor's Interest
Recorded: 2023-05-23
Pages: 17
Assignors
KAMIKAWA, TAKESHI
Executed: 2022-10-25
AOKI, YUTA
Executed: 2022-10-25
TAKEUCHI, KAZUMA
Executed: 2022-12-22
MASAKI, KATSUAKI
Executed: 2022-11-29
YAMASHITA, FUMIO
Executed: 2022-10-27
Assignee
KYOCERA CORPORATION
6 TAKEDA TOBADONOCHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Semiconductor Substrate, and Manufacturing Method and Manufacturing Apparatus of Semiconductor Substrate