Patent Assignment
Reel/Frame 063742/0508
Assignment of Assignor's Interest
Recorded: 2023-05-24
Pages: 2
Assignors
MAO, KUAN-HSIANG
Executed: 2023-05-17
YANG, SHU-HAN
Executed: 2023-05-24
HIEW, PEY FANG
Executed: 2023-05-17
HUANG, WEN HUNG
Executed: 2023-05-15
Assignee
B.V., NXP
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Semiconductor Device Having Wired Under Bump Structure and Method Therefor