Patent Assignment
Reel/Frame 063743/0497
Assignment of Assignor's Interest
Recorded: 2023-05-24
Pages: 3
Assignor
MATSUO, YUHEI
Executed: 2023-05-11
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method