Patent Assignment
Reel/Frame 063744/0656
Assignment of Assignor's Interest
Recorded: 2023-05-24
Pages: 4
Assignors
HSU, KUO-CHING
Executed: 2023-05-24
LU, HSIANG-TAI
Executed: 2023-05-22
WU, MORPHY
Executed: 2023-05-22
LEE, YA HUEI
Executed: 2023-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Interposer with Built-in Wiring for Testing an Embedded Integrated Passive Device and Methods for Forming the Same