Patent Assignment
Reel/Frame 063757/0431
Assignment of Assignor's Interest
Recorded: 2023-05-25
Pages: 3
Assignors
WANG, PEI-YU
Executed: 2023-05-24
HUANG, WANG-CHUN
Executed: 2023-05-18
CHUNG, CHENG-TING
Executed: 2023-05-18
LIAO, YI-BO
Executed: 2023-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/322,611 →
Publication:
US 2024/0395861