Patent Assignment
Reel/Frame 063758/0001
Assignment of Assignor's Interest
Recorded: 2023-05-25
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2023-05-19
LIN, MENG-LIANG
Executed: 2023-05-21
CHEN, YING-JU
Executed: 2023-05-21
JENG, SHIN-PUU
Executed: 2023-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Structures for Reducing Gap Fill Defects in a Vertically Stacked Semiconductor Device and Methods for Forming the Same
Application:
18/323,455 →
Publication:
US 2024/0395610