Assignment of Assignor's Interest

Recorded: 2023-05-25 Pages: 6

Assignors

KIM, JAESUN

Executed: 2023-03-22

LEE, SANGHYUN

Executed: 2023-03-24

JANG, YEONHO

Executed: 2023-03-23

CHOI, YUNSEOK

Executed: 2023-03-23

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package Including a Pad Comprising a Connection Portion Connecting a First and Second Pad Portions

Application: 18/323,646 →

Publication: US 2024/0096777